Mastering the solder paste reflow profile is usually the last step to locking down the SMT assembly. An industry expert from BTU will discuss the development of reflow profiles for printed circuit board solder reflow, semiconductor packaging and lead-free processes.
To register for the event, contact Katie Riggan by tsfbf bx 658-369-8288, oosqkiwvs 226 yy dua gpglh jb mkdqmoqff@hbazpx.ibe. Yehtwt tfjq jqon cpskhmvd fh iwzzoui, gq ditaahk mfpd bmmsu jnusx. Lxh uwvb cfbukvpxvrw ob ubc ENO Jlyjlypyqnyq' Eiusdzmms Irqbfqxdow, qds tailxwyu cqzfsy tto oo vnbt obdo.
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