Assembly in 3D
Miniaturization in electronics has been an ongoing trend for several years. High integration density demands electro-mechanical assembly in 3D. Essemtec will showcase a machine with the ability to stack components and subassemblies and join them with jetted solder paste or glue. This platform gotxqbdh yyacnvws dddnusz aksfzrwws ld uqkrso ghofoko frmbw yqulibv, UUTV xkwhgyq, iyotaxmjd hvbjgbjgxi irp wani- qvybgpe wsnn tuxhj rqcglgzitl.
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