Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 NPI Award in the category of Component Placement - Multi-function for its multi-functional SMT Center. The award was presented to the company during a Tuesday, March 25, 2014 ceremony that took place at the Mandalay Bay Convention Center during the IPC APEX EXPO. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.
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