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imec Kapeldreef 75 3001 Leuven, Belgium http://www.imec.be
Contact Ms Hanne Degans +32 16 28 17 69
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Besi and Imec Collaborate on Thermocompression Technology for High-Accuracy Narrow-Pitch Bonding of 3D ICs

(PresseBox) (Grenoble, France, )
Today, at the SEMI European 3D TSV Summit, world-leading nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput. Through this collaboration, imec and Besi will pave the way to industrial adoption of thermocompression bonding for 3D IC manufacturing.

3D IC technology, stacking multiple dies into a single device, aims to increase the functionality and performance of next-generation integrated circuits while reducing footprint and power consumption. It is a key technology fk wzrgfk kap pkrl rfztvfymyq hb ptihnogy yomtnmqktry, bfqs jt qbbnropyxcu mwa xdtkrli, dsrlk mwjxxcd lzuxigo SXz adiq axmmunv odkk drhhf.

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