As the countdown to Productronica 2023 begins, Finetech is gearing up to showcase its cutting-edge manual and automatic die bonders at booth B2-403. With over 30 years of experience in high-precision micro assembly and advanced die attach, Finetech is a leading supplier in the industry.
The company’s mission is clear: to bring your visions to life. Through close collaboration with customers, Finetech crafts tailored process and equipment solutions to meet individual customer application requirements. The modular die bonder hardware and software enable flexible machine configurations that can adapt to new challenges at any time.
Finetech’s “prototype-to-production” approach facilitates seamless transitions from R&D to production, offering integrated, flexible, and cost-efficient product development.
Key Highlights at Booth B2-403
1. Fine Pitch Micro Indium Bump Array Bonding: Finetech has perfected assembly processes for large-scale, high-density IR thermal imaging FPA devices, quantum processors, and micro LED displays. Quick machine setup and intelligent material handling and cleaning solutions reduce preparation time by up to 50%.
2. CoC / CoS Laser Diode Module Manufacturing: Partner with Finetech to take control of the development and production of your laser modules. Experience technology sovereignty, customizability, cost reduction, and increased reliability and quality.
3. Reactive Soldering with RMS: This efficient bonding technology allows for fast and localized soldering of mid-sized to large components into packages with high thermal mass. A laser pulse is used to activate or ignite reactive multilayer systems (RMS) such as preforms or nanofoils, making it ideal for automated multi-chip module assembly.
4. Your Process Refined: Finetech understands that hardware and software must be perfectly in tune with each other and the application. Recent innovations include improved machine and process parameters, process modules, and specialized tooling.
5. Applications Unlimited: Flexibility, adaptability, and accuracy are at the core of Finetech’s strengths. The company develops optimal process solutions for a wide range of applications across various industries, including Photonics, Silicon Photonics components, Sensors and Detectors, Electronic Devices, Actuators, Displays, Fluidic Devices, and more.
During Productronica 2023, Finetech will present state-of-the-art die bonding equipment, including the FINEPLACER® femtoblu, FINEPLACER® pico 2, and FINEPLACER® femto 2, each designed to meet specific needs in photonics production, lab research, and advanced automated sub-micron bonding.
Why Choose Finetech?
The company’s mission is clear: to bring your visions to life. Through close collaboration with customers, Finetech crafts tailored process and equipment solutions to meet individual customer application requirements. The modular die bonder hardware and software enable flexible machine configurations that can adapt to new challenges at any time.
Finetech’s “prototype-to-production” approach facilitates seamless transitions from R&D to production, offering integrated, flexible, and cost-efficient product development.
Key Highlights at Booth B2-403
1. Fine Pitch Micro Indium Bump Array Bonding: Finetech has perfected assembly processes for large-scale, high-density IR thermal imaging FPA devices, quantum processors, and micro LED displays. Quick machine setup and intelligent material handling and cleaning solutions reduce preparation time by up to 50%.
2. CoC / CoS Laser Diode Module Manufacturing: Partner with Finetech to take control of the development and production of your laser modules. Experience technology sovereignty, customizability, cost reduction, and increased reliability and quality.
3. Reactive Soldering with RMS: This efficient bonding technology allows for fast and localized soldering of mid-sized to large components into packages with high thermal mass. A laser pulse is used to activate or ignite reactive multilayer systems (RMS) such as preforms or nanofoils, making it ideal for automated multi-chip module assembly.
4. Your Process Refined: Finetech understands that hardware and software must be perfectly in tune with each other and the application. Recent innovations include improved machine and process parameters, process modules, and specialized tooling.
5. Applications Unlimited: Flexibility, adaptability, and accuracy are at the core of Finetech’s strengths. The company develops optimal process solutions for a wide range of applications across various industries, including Photonics, Silicon Photonics components, Sensors and Detectors, Electronic Devices, Actuators, Displays, Fluidic Devices, and more.
During Productronica 2023, Finetech will present state-of-the-art die bonding equipment, including the FINEPLACER® femtoblu, FINEPLACER® pico 2, and FINEPLACER® femto 2, each designed to meet specific needs in photonics production, lab research, and advanced automated sub-micron bonding.
Why Choose Finetech?
- Expertise Beyond Measure: With over 30 years of experience, Finetech is a die bonding expert, ready to turn your obstacles into opportunities.
- Tailored Solutions: Finetech understands that no two projects are the same, offering customized solutions designed to fit unique requirements.
- From Concept to Market: The “Prototype-to-Production” approach ensures fast, low-risk flexible product development and seamless process transfer.
- Accuracy Redefined: Finetech’s commitment to perfection goes beyond placement accuracy, touching every aspect of die bonding.
- Lifelong Flexibility: Finetech’s support extends beyond the sale, adapting to your changing needs throughout the machine’s lifecycle.
