Low SWaP ultra-lightweight - embedded system for mobile applications

Low SWaP NVIDIA® Jetson Embedded System

(PresseBox) (Reutlingen, 10/17/2024)

With the FLYC-300, ICP Germany offers a particularly light and compact embedded system for use in mobile applications. At just 297 grams or 345 grams with housing cover and a size of only 124x123x30.5mm with or 124x123x29.8mm without housing, the system can be used in flying drones, among other things. A total of four systems are available in different versions. What they all have in common is the NVIDIA® Jetson ORIN™ NX SoM platform with ARM Cortex CPU and NVIDIA® Ampere GPU with either 8GB or 16GB RAM. Two models are offered as a heatspreader motherboard bundle, two others are available with an additional housing cover. A 65mm fan can be adapted as an option. For mass storage, the FLYC offers an NVME Gen4x4 M.2 2230 slot. The FLYC-300 can be expanded using the two GMSL2 camera interfaces with FAKRA Z connectors, which support a Full HD resolution at 60 frames per second or a resolution of 2880x1860 at 30 FPS, the 2.5GbE and GbE network interfaces, two USB 3.1 ports, the micro SD slot and the display port. Internally, USB 2.0, CAN 2.0, I²C, two isolated digital inputs and four isolated digital outputs as well as a UART are available. The FLYC-300 also offers an M.2 3042/3052 with micro SIM card slot. Depending on the type of installation, the FLYC can be used in a temperature range of up to -25 °C to 70 °C. The special XT-30 voltage input supports voltages from 12 VDC to 60 VDC and 4T-14S battery packs.

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Specifications