“Like all institutes of the Fraunhofer Gesellschaft, we are always aware of the practical benefits of our research,” says Dr Jennifer Ruskowski Head of 3D Sensors at Fraunhofer IMS. “Our new single-photon avalanche diodes (SPADs) are about a hundred times more sensitive than the photodiodes used in smartphones. The integration of sensor and readout electronics in a CMOS chip enables very powerful 1- and 2-dimensional detector arrays. Customized adaptations are possible. LASER COMPONENTS is a partner with experience in many areas of technology and is able to contribute its own ideas to our work.”
“The developments of Fraunhofer IMS are an optimal complement to our own LiDAR products,” explains Patrick Paul, managing director at LASER COMPONENTS. “Especially in this area, rapid technical progress can be observed currently. Cooperation with a renowned development institute is, therefore, an important strategic step for us.”
Trade Shows
Vision, November 06 - 08, 2018, Messe Stuttgart, Germany, Booth 1G31
electronica, November 13 – 16, 2018, Munich, Germany, Booth B3.524
SPIE Photonics West, February 05 – 07, 2019, San Francisco, USA, Booth 1751
ATX West Automation, February 05 – 07, 2019, Anaheim, CA, USA, Booth 4166
BREKO, March 27 – 28, 2019, Wiesbaden, Germany
Automate, April 08 – 11, 2019, Chicago, IL, USA, Booth 8536
SPIE DCS, April 16 – 18, 2019, Orlando, FL, USA, Booth 524
ANGACOM, June 04 – 06, 2019, Cologne, Germany
Sensors Expo & Conference, June 25 – 27, 2019, San Jose, CA, USA, Booth 419
LASER World of PHOTONICS, June 24 – 27, 2019, Munich, Germany
SPIE Optics+Photonics, August 13 – 15, 2019, San Diego, CA, USA