ADLINK Technology Inc. (TAIEX: 6166), a leading supplier of industrial building blocks, will present amongst other products the following new highlights at the Embedded World Show Nuremberg at booth 1/1-532:
1) Our latest COM Express® offering, the Express-IB:
The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel® Core(TM) i7/i5/i3 processor supporting Intel® HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).
The Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is ideal for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality.
New with the COM Express Type 6 module are three Digital Display Interface (DDI) ports supporting HDMI, DVI and DisplayPort outputs, in addition to legacy VGA and dual-channel 18/24-bit LVDS displays. The Express-IB also offers Gigabit Ethernet, up to four USB 3.0 ports, four USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports (RAID 0/1/5/10) and support for SMBus and I2C. The module is equipped with AMI EFI BIOS supporting remote console, CMOS backup, hardware monitor and watchdog timer.
2) Ampro by ADLINK(TM) Extreme Rugged(TM) CoreModule® 720:
PC/104-Plus Single Board Computer (SBC) with Intel® Atom(TM) Processor E600T Series and Industrial ReadyBoard(TM) 910 EPIC SBC with 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors. Both SBCs feature onboard Solid State Drives (SSD) and provide a compact form factor suitable for applications in harsh environments such as transportation, self-service, digital signage, and video surveillance.
The CoreModule 720 is based on the Intel® Atom(TM) Processor E600T series from 600 MHz up to 1.6 GHz in PC/104-Plus stackable form factor, allowing customers to build low power solutions for space constrained, extreme rugged environments. The CoreModule 720 provides PCI and ISA bus connectivity, an integrated industrial grade 8GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2 GB DDR2 industrial grade soldered SDRAM at 667/800 MHz and 24-bit LVDS and SDVO graphics. The Intel® Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses a 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40°C to +85°C.
The ReadyBoard 910 integrates the 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors (Socket G2) and mobile Intel® HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
3) Intel® Atom(TM) D2550 Processor-Based Fanless Embedded Computer MXE-1300
Our new Matrix MXE-1300 series of low-power fanless computers based on the Intel® Atom(TM) D2550 processor is equipped with the Intel® Atom(TM) D2550 processor, the MXE-1300 increases processing power by 44% and graphics performance by 90% over the previous Intel® Atom(TM) platform. Featuring low power consumption, rich I/O capability, and large storage with 3.5" HDD support, the MXE-1300 series not only leads the market with its fanless, cable-free and robust mechanical design in a compact form factor, but also makes an ideal application-oriented platform for digital surveillance, intelligent transportation, and factory automation applications.
3.5" HDD Support in a Compact Form
The ADLINK MXE-1300 series adapts a 3.5" standard height hard disk drive to a 210 mm (W) x 170 mm (D) x 58 mm (H) containment, providing the industry's most compact fanless system supporting 3.5" storage capability, significantly reducing storage costs and physical space requirements for high-resolution image processing and transmission applications.
Rugged Design
Featuring operating shock tolerance up to 100 G, an extended market-leading operating temperature range of -20°C to 70°C, and unique thermal design with zero cable management requirements, the MXE-1300 provides reliable performance in mission-critical and harsh environments.The MXE-1300 also supports multiple OS, including Windows 7, Windows 7 Embedded, Windows XP, Windows XP Embedded, WinCE 7.0, and Linux.
1) Our latest COM Express® offering, the Express-IB:
The Express-IB is a high performance COM.0 R2.0 Type 6 module featuring an Intel® Core(TM) i7/i5/i3 processor supporting Intel® HD Graphics integrated on the CPU with three independent displays. A PCI Express x16 Generation 3.0 bus is available for discrete graphics expansion or general purpose PCIe (optionally configure as 2 x8 or 1 x8 + 2 x4).
The Express-IB targets applications in Government, Military, Medical, Digital Signage and Communications and is ideal for customers with advanced processing performance and graphics requirements looking to reduce development time by outsourcing the base design of their system and focusing on application functionality.
New with the COM Express Type 6 module are three Digital Display Interface (DDI) ports supporting HDMI, DVI and DisplayPort outputs, in addition to legacy VGA and dual-channel 18/24-bit LVDS displays. The Express-IB also offers Gigabit Ethernet, up to four USB 3.0 ports, four USB 2.0 ports, two SATA 6 Gb/s ports and two SATA 3 Gb/s ports (RAID 0/1/5/10) and support for SMBus and I2C. The module is equipped with AMI EFI BIOS supporting remote console, CMOS backup, hardware monitor and watchdog timer.
2) Ampro by ADLINK(TM) Extreme Rugged(TM) CoreModule® 720:
PC/104-Plus Single Board Computer (SBC) with Intel® Atom(TM) Processor E600T Series and Industrial ReadyBoard(TM) 910 EPIC SBC with 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors. Both SBCs feature onboard Solid State Drives (SSD) and provide a compact form factor suitable for applications in harsh environments such as transportation, self-service, digital signage, and video surveillance.
The CoreModule 720 is based on the Intel® Atom(TM) Processor E600T series from 600 MHz up to 1.6 GHz in PC/104-Plus stackable form factor, allowing customers to build low power solutions for space constrained, extreme rugged environments. The CoreModule 720 provides PCI and ISA bus connectivity, an integrated industrial grade 8GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2 GB DDR2 industrial grade soldered SDRAM at 667/800 MHz and 24-bit LVDS and SDVO graphics. The Intel® Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses a 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40°C to +85°C.
The ReadyBoard 910 integrates the 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors (Socket G2) and mobile Intel® HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
3) Intel® Atom(TM) D2550 Processor-Based Fanless Embedded Computer MXE-1300
Our new Matrix MXE-1300 series of low-power fanless computers based on the Intel® Atom(TM) D2550 processor is equipped with the Intel® Atom(TM) D2550 processor, the MXE-1300 increases processing power by 44% and graphics performance by 90% over the previous Intel® Atom(TM) platform. Featuring low power consumption, rich I/O capability, and large storage with 3.5" HDD support, the MXE-1300 series not only leads the market with its fanless, cable-free and robust mechanical design in a compact form factor, but also makes an ideal application-oriented platform for digital surveillance, intelligent transportation, and factory automation applications.
3.5" HDD Support in a Compact Form
The ADLINK MXE-1300 series adapts a 3.5" standard height hard disk drive to a 210 mm (W) x 170 mm (D) x 58 mm (H) containment, providing the industry's most compact fanless system supporting 3.5" storage capability, significantly reducing storage costs and physical space requirements for high-resolution image processing and transmission applications.
Rugged Design
Featuring operating shock tolerance up to 100 G, an extended market-leading operating temperature range of -20°C to 70°C, and unique thermal design with zero cable management requirements, the MXE-1300 provides reliable performance in mission-critical and harsh environments.The MXE-1300 also supports multiple OS, including Windows 7, Windows 7 Embedded, Windows XP, Windows XP Embedded, WinCE 7.0, and Linux.
