SplitMaster - the newest mycon device is used to partially cool components as an open or closed system. During long-term-use the operating materials can be completely processed so that they can be reused.
SplitMaster cools down surfaces to temperatures as low as -70°C quickly and efficiently. Partial cooling is also possible. Being able to reach such low temperatures quickly has advantages when cleaning contaminated surfaces and separating bonded parts, for example. The bond areas of the components are made brittle by the freezing temperatures, which enables easy separation.
SplitMaster cools down surfaces to temperatures as low as -70°C quickly and efficiently. Partial cooling is also possible. Being able to reach such low temperatures quickly has advantages when cleaning contaminated surfaces and separating bonded parts, for example. The bond areas of the components are made brittle by the freezing temperatures, which enables easy separation.
