Utilizing the method of glass potting (tested helium leakage rate < 10- 9 mbar l/s), the new ODU MINI-SNAP® receptacles, not only meet the demanding requirements of the UHV-suitable interfaces but also comply with high-performance data transfer. In addition, the hermetically sealed receptacles are characterized by an complete autoclavability with up to 500 cycles. Additional product features include: 5,000 mating cycles, pin and socket variant, rear panel installation, temperature range from -20 °C to +120 °C.
HERMETIC SEALING - New ODU MINI-SNAP® receptacles
Utilizing the method of glass potting (tested helium leakage rate < 10- 9 mbar l/s), the new ODU MINI-SNAP® receptacles, not only meet the demanding requirements of the UHV-suitable interfaces but also comply with high-performance data transfer. In addition, the hermetically sealed receptacles are characterized by an complete autoclavability with up to 500 cycles. Additional product features include: 5,000 mating cycles, pin and socket variant, rear panel installation, temperature range from -20 °C to +120 °C.