What highlights does ODU offer at the booth?
In particular, the spotlight will be on the new, space-saving mass interconnect solution. The compact version of the ODU-MAC® Black-Line requires only half the width of a 19-inch cabinet. This variant responds to the market's desire for a small yet flexible test interface. Customers benefit from the optimization due to the small space requirement with unchanged modularity.
Another highlight is the PCB connection, which will be on display together with the electromechanical and manual versions of the mass interconnect solutions. In addition, a team of ODU experts will be available to answer questions of interested parties about modular and circular connectors as well as cable assembly.
Where is the trend heading?
The transmission of high current and high voltage are important topics. Developments in electromobility are influencing the requirements for tests and thus for the connectors and mass interconnect interfaces. ODU developments will also be on display at the booth.
Visit the ODU team at productronica from November 14 to 17, 2023 in Hall A1, Booth 131 in Munich and learn more.