SEMIKRON presents the updated "Power Semiconductor Application Manual" hot of the press in time for the PCIM trade fair. The 452 pages of the manual provide electronics experts with detailed information on the selection and use of IGBT, MOSFET, diode and thyristor components.
The application manual contains detailed application-related information such as electrical configurations for key operating conditions, driver and protection elements for semiconductors, thermal dimensioning and cooling, hints on parallel and series connection, assembly guidelines for optimised power layouts with regard to parasitic elements, as well as notes to help users better understand datasheets and the requirements that arise from specific ambient conditions. Assembly and connection technologies which have a major impact on the properties of semiconductor modules and the limits in field applications are also described, as are reliability data, life cycle analyses and key test processes.
SEMIKRON will initially be publishing the updated English version of the manual. The English application manual is available at bookstores under the ISBN No. 978-3-938843-83-3 for € 9.25 and via the SEMIKRON Online Shop shop.semikron.com. A PDF version is also available on the SEMIKRON website. The German version is planned to be available in autumn 2015.
"The affordable price makes this book accessible to a multitude of users", says Dr. Arendt Wintrich, one of the four authors of the manual and specialist for applications and simulations at Semikron. "This book is written for users and provides help with component selection and design-in work. It encompasses a wealth of experience and detailed practical knowledge." The three co-authors are Dr.-Ing. Ulrich Nicolai and Dr. Techn. Werner Tursky from Semikron, as well as university professor Dr.-Ing. Tobias Reimann, head of Industrial Electronics at the Technical University of Ilmenau.
The application manual contains detailed application-related information such as electrical configurations for key operating conditions, driver and protection elements for semiconductors, thermal dimensioning and cooling, hints on parallel and series connection, assembly guidelines for optimised power layouts with regard to parasitic elements, as well as notes to help users better understand datasheets and the requirements that arise from specific ambient conditions. Assembly and connection technologies which have a major impact on the properties of semiconductor modules and the limits in field applications are also described, as are reliability data, life cycle analyses and key test processes.
SEMIKRON will initially be publishing the updated English version of the manual. The English application manual is available at bookstores under the ISBN No. 978-3-938843-83-3 for € 9.25 and via the SEMIKRON Online Shop shop.semikron.com. A PDF version is also available on the SEMIKRON website. The German version is planned to be available in autumn 2015.
"The affordable price makes this book accessible to a multitude of users", says Dr. Arendt Wintrich, one of the four authors of the manual and specialist for applications and simulations at Semikron. "This book is written for users and provides help with component selection and design-in work. It encompasses a wealth of experience and detailed practical knowledge." The three co-authors are Dr.-Ing. Ulrich Nicolai and Dr. Techn. Werner Tursky from Semikron, as well as university professor Dr.-Ing. Tobias Reimann, head of Industrial Electronics at the Technical University of Ilmenau.
