SEMITOP® is available now with two optional PCB interface connections: solder terminals or Press-Fit Technology. Press-Fit Technology is the alternative solution to solder mounting and an easy exchange from soldered to solder-free assembly is possible thanks to the 100% pin-out compatibility. Customers can therefore choose the right terminal interface in order to optimise their production process and achieve fast time to market. Pins on the edges make the PCB routing simple, allowing for more internal space available to fit the most complex technologies inside a very compact space.
SEMITOP® is an insulated power module without a baseplate using only one mounting screw to fit to the heat sink. The pressure technology concept and the single mounting screw guarantees a low thermal resistance and reduced mechanical stress for high reliability. The one-screw mounting concept offers the easiest mounting concept for a fast, reliable and low cost assembly as competition modules may require two or more mounting screws. The outstanding product reliability is tested and confirmed by SEMIKRON's extended qualification program consisting of as much as 17 different qualification and reliability tests, some exceeding industrial standards being performed for more than 2500h.
A large variety of configurations with different chip technologies is possible inside SEMITOP®4 (60x55mm2), SEMITOP®3 (55x31mm2), SEMITOP®2 (40.5x28mm2) for both soldered and press-fit terminals and SEMITOP®1 (31x24mm2) only for solder terminal technology. New high performance configurations such as 3-level inverter (NPC) and mixed 3-level inverter (TNPC), double boost and interleaved boost applications are available besides the standard configurations like 3-phase inverter, converter-inverter-brake solutions, MOSFET configurations even for high voltage and 3-phase bridge rectifiers. The integration of the latest SiC diodes and SiC MOSFET technology for high frequency applications further expands the SEMITOP® range: full SiC solutions (SiC MOSFET with or without diodes) or hybrid solutions (Si IGBT in combination with SiC free-wheeling diode) can be designed based on specific customer demand.
With only 12mm height, the SEMITOP® is one of the most compact isolated power modules on the market for the low and medium power range from only a few kW up to 60kW output power. Supported by the flat and compact module design, the SEMITOP® is characterised by a low module inductance. The excellent pin-out flexibility offers an additional degree of freedom for performance optimised PCB layouts. Multiple paralleling of modules on the same PCB is possible thanks to the 12mm height compatibility, thus reducing the development time of the whole assembly and improving the time to market. High integration level philosophy in combination with the availability of the latest Si and SiC chip technology make the SEMITOP® product family suitable for competitive, innovative and future proof designs in markets such as UPS, solar, motor drives, power supplies and welding.
SEMITOP® is an insulated power module without a baseplate using only one mounting screw to fit to the heat sink. The pressure technology concept and the single mounting screw guarantees a low thermal resistance and reduced mechanical stress for high reliability. The one-screw mounting concept offers the easiest mounting concept for a fast, reliable and low cost assembly as competition modules may require two or more mounting screws. The outstanding product reliability is tested and confirmed by SEMIKRON's extended qualification program consisting of as much as 17 different qualification and reliability tests, some exceeding industrial standards being performed for more than 2500h.
A large variety of configurations with different chip technologies is possible inside SEMITOP®4 (60x55mm2), SEMITOP®3 (55x31mm2), SEMITOP®2 (40.5x28mm2) for both soldered and press-fit terminals and SEMITOP®1 (31x24mm2) only for solder terminal technology. New high performance configurations such as 3-level inverter (NPC) and mixed 3-level inverter (TNPC), double boost and interleaved boost applications are available besides the standard configurations like 3-phase inverter, converter-inverter-brake solutions, MOSFET configurations even for high voltage and 3-phase bridge rectifiers. The integration of the latest SiC diodes and SiC MOSFET technology for high frequency applications further expands the SEMITOP® range: full SiC solutions (SiC MOSFET with or without diodes) or hybrid solutions (Si IGBT in combination with SiC free-wheeling diode) can be designed based on specific customer demand.
With only 12mm height, the SEMITOP® is one of the most compact isolated power modules on the market for the low and medium power range from only a few kW up to 60kW output power. Supported by the flat and compact module design, the SEMITOP® is characterised by a low module inductance. The excellent pin-out flexibility offers an additional degree of freedom for performance optimised PCB layouts. Multiple paralleling of modules on the same PCB is possible thanks to the 12mm height compatibility, thus reducing the development time of the whole assembly and improving the time to market. High integration level philosophy in combination with the availability of the latest Si and SiC chip technology make the SEMITOP® product family suitable for competitive, innovative and future proof designs in markets such as UPS, solar, motor drives, power supplies and welding.
