Today, industry standard power module packages are seen as commodities. Supply chain security for these modules is one of the most important requirements. Being compatible on the one hand, SEMIKRON standard modules even exceed these standards on the other hand. At the same time, however, power densities and reliability requirements are constantly increasing.
With the introduction of the SEMiX 6, every single industry standard package is now available at SEMIKRON.
The SEMiX 6 module platform constitutes a scalable and flexible solution for demanding and high-performance inverter architectures. It features press-fit technology for both the auxiliary and power terminals. Using press-fit technology for all the terminals reduces assembly costs to a minimum and offers the possibility of 100% process control. SEMiX 6 introduces a new press-fit technology designed to ensure full compatibility with the market standard, yet is optimized for gentle and reliable PCB assembly.
SEMiX 6 will be available as a B6U rectifier module for up to 2200V. These modules will mark the launch of our new SKR PEP rectifier technology for leading edge power density and environmental robustness. With junction temperatures of up to 175°C, this technology delivers far superior performance than comparable solutions on the market. This improved performance combined with SEMIKRON’s design for minimum power losses is ideal when it comes to achieving compact inverter systems on a single PCB basis. The target area of application is rectifiers for motor drives of up to 160kW. The rectifier portfolio is the perfect match for the IGBT 6-packs in the same module package, equipped with the latest IGBT chip technology in 650V, 1200V and 1700V.
This tried and tested package features a robust baseplate solution combined with a full press-fit concept for all the electric terminals, creating a competitive platform for all-in-one PCB inverter solutions. The package is suitable for a broad range of applications such as AC inverter drives, UPS systems and renewable energy systems.
With the introduction of the SEMiX 6, every single industry standard package is now available at SEMIKRON.
The SEMiX 6 module platform constitutes a scalable and flexible solution for demanding and high-performance inverter architectures. It features press-fit technology for both the auxiliary and power terminals. Using press-fit technology for all the terminals reduces assembly costs to a minimum and offers the possibility of 100% process control. SEMiX 6 introduces a new press-fit technology designed to ensure full compatibility with the market standard, yet is optimized for gentle and reliable PCB assembly.
SEMiX 6 will be available as a B6U rectifier module for up to 2200V. These modules will mark the launch of our new SKR PEP rectifier technology for leading edge power density and environmental robustness. With junction temperatures of up to 175°C, this technology delivers far superior performance than comparable solutions on the market. This improved performance combined with SEMIKRON’s design for minimum power losses is ideal when it comes to achieving compact inverter systems on a single PCB basis. The target area of application is rectifiers for motor drives of up to 160kW. The rectifier portfolio is the perfect match for the IGBT 6-packs in the same module package, equipped with the latest IGBT chip technology in 650V, 1200V and 1700V.
This tried and tested package features a robust baseplate solution combined with a full press-fit concept for all the electric terminals, creating a competitive platform for all-in-one PCB inverter solutions. The package is suitable for a broad range of applications such as AC inverter drives, UPS systems and renewable energy systems.
