Production of this multilayer ceramic capacitor will commence at the company's Tamamura Plant (Tamamura-machi, Sawa-gun, Gunma Prefecture, Japan) from February 2016 onward at a production rate of 10 million units per month.
Technology Background
Multilayer ceramic capacitors are placed near an IC device mounted in a smartphone or a wearable device for the purpose of decoupling. In accordance with a reduction in thickness of devices, improvement in functionality, and increase in the battery size, the mounting area available to parts is decreasing. In addition to further reducing the size of electronic parts, there is a need to implement higher-density mounting, which includes mounting low-profile parts inside or at the back of the IC package, rather than the conventional methods of mounting parts on the substrate. To address this market need, TAIYO YUDEN has commercialized the world’s thinnest 0603-size multilayer ceramic capacitor, the “JMK063 BJ104ML,” having a thickness of 0.11 mm, and has thereby expanded its lineup of low-profile multilayer ceramic capacitors. The capacitor is roughly 27% thinner than our conventional 0603-size capacitor, the “JMK063 BJ104MH,” with a height of 0.15 mm, and it reduces the mounting area to approximately 64% of that of our conventional 1005-size capacitor, the “JMK105VBJ104ML,” with the same height of 0.11 mm (1.0 x 0.5 x 0.11 mm, with the maximum height value). We will continue to actively promote the product development of low-profile multilayer ceramic capacitors to realize a smaller size, thinner profile, and higher capacitance.
Application
For decoupling of IC power supply lines in devices that are required to be small and thin, such as smartphones and wearable devices. The product lineup of the low-profile multilayer ceramic capacitor that is currently being commercialized is as follows:
Part number JMK063 BJ104ML
Capacitance 0.1μF
Temperature characteristics X5R
Rated voltage 6.3V
Length (L) [mm] 0.6 ± 0.03
Width (W) [mm] 0.3 ± 0.03
Thickness (T) [mm] max. 0.11