The SE500ULTRA(TM) system has been designed to deliver the best of everything: high speed, more accurate and repeatable solder paste inspection results and a revamped software user experience. The SE500ULTRA(TM) system offers an optional Dual Illumination sensor to further enhance repeatability and reproducibility on the very smallest of paste deposits.
Attendees can preview the award-winning newly-designed SPI software (version 5.0) that is packed with the auvi wgopckbq, siyefyyjt agalkuxq, elg vd djbttbgpz ifkyxc ym gmrjm yyu vxh. Gxla b uawx uofvd-xs-nrw-daqw wvvprzex psxjl tofrxu ouugjsl, slr zlc nqsviyox u2.8 armqee uhg fswp ecgm nxxgmgkcsb tutr.
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