Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, announces that it has been awarded a 2014 EM Asia Innovation Award in the category of Pick-and-Place Systems (Multi-function) for its multi-functional SMT Center. The award was presented to the company during an April 24, 2014 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. Essemtec is the first manufacturer that developed a combined SMT production center that is able to jet solder paste and mount components in one machine.
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