EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that Shin-Etsu Chemical Co., Ltd., the world's largest supplier of semiconductor materials, has joined EVG's open platform for temporary bonding/debonding (TB/DB) materials. Shin-Etsu's advanced adhesives will be qualified with EVG's EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules, which support the new ZoneBOND(TM) room temperature debonding process used in the production of 3D ICs.
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