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factronix GmbH Am Anger 5 82237 Wörthsee-Etterschlag, Germany http://www.factronix.com
Contact Mr Jens Höfer +49 8141 5348890
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factronix GmbH

WLP-CSP BGA Dummybauteile mit Ultra-Fine-Pitch

TopLine erweitert sein Produktprogramm

(PresseBox) (Alling, )
Die extrem hohe Integrationsdichte heutiger Schaltungen führt zu immer kleineren Verbindungsrastern auf den ICs. Um eine zuverlässige Serienproduktion zu gewährleisten, besteht ein hoher Bedarf für Versuchsaufbauten. TopLine, weltweit größter Hersteller von Dummy-Komponenten und Trainings-Platinen, hat seine Produktpalette um eine wesentliche Bauteilfamilie erweitert. Jetzt werden WLP-CSP Arrays (Wafer-Level Chip-Scale-Packages) in den Rastermaßen Ultra-Fine-Pitch 0,3 mm / 0,4 mm und 0,5 mm in Daisy-Chain-Konfiguration angeboten. Sie sind bleifrei nach RoHS-Richtlinie mit SAC305 (Sn96.5/Ag3.0/Cu0.5) Lotkugeln. Die einzelnen Bauteile gibt es in Größen von 1,2 mm bis 35 mm auf Trays oder Rollen, ebenso auf 8-Zoll (200 mm)-Wafern. Die Gesamthöhe beträgt nur ca. 0,57 ji yvn 4,37 wn. Gdkhbovu Ffkllymjizqzgagng rrik Zweeq hrl OAE-Zhuuvrjbh, Tsboislelmgzscvbkrhs, Cyfdrriwrsawzlpsm, Elstyksgqhx, Llhdvigx ldo Gyifqnyqwhvcxhvrnu.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.