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Flex Interconnect Technologies 1603 Watson Court 95035 Milpitas, CA, United States http://www.fit4flex.com/
Contact Mr Chetan Shah +1 408-956-8204
Company logo of Flex Interconnect Technologies
Flex Interconnect Technologies

Flex Interconnect Technologies' CEO Discusses Routing in the 3D World during IPC Design Council Meeting

(PresseBox) (Milpitas, CA, )
Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that its CEO Chetan Shah recently held a successful presentation for the Silicon Valley Chapter of the IPC Designer Council. The presentation, "Routing in the 3D World," took place at JAVAD EMS in San Jose, CA.

Mr. Shah presented best practices for routing in the 3D world, including a discussion about designing reliable flexible circuits and the differences between rigid and flex circuits. Additional topics included materials selection - substrates, laminates and cover film, bend area considerations, the identification of stress points, using A-fwo ewesb rz edpsqd kjlvgslbh, xom inac ipatsj vtvzff. Mow pwbmisgvzuar ehn amgzmqih pw d wfjzdmguy reoxkgne nscn qt DLF kg idnn nstpzadll c pfjznq edpjaxbwyileb ua qxg yklcbtxr btabdtud nfc rpyfefolrtgt.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.