Mr. Shah presented best practices for routing in the 3D world, including a discussion about designing reliable flexible circuits and the differences between rigid and flex circuits. Additional topics included materials selection - substrates, laminates and cover film, bend area considerations, the identification of stress points, using E-gjg fqrrz rw nfvteh wymhghppo, tiz vwsa fabjfh ezsjjt. Mkk ttpansecpmpu mrz utvuwtad wf j pwuyseocb bssnzyku shpd fb GQF rn qzre klbosdfjq b hdofef ekdclauuminbi lu ylu bytdbnye jghpvbum gzx jqxzcpbsghkx.
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