Kyzen announces that Debbie Carboni will present at the upcoming Cleaning and Reliability workshop, together with Aqueous Technologies, FCT Assembly, Nordson DAGE and Heller on Thursday, October 24, 2013 in Marlborough, MA. Carboni will discuss the cleaning technology innovations needed to clean highly dense assemblies.
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is becoming increasingly more important. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow
As highly dense circuit assemblies continue to advance at a rapid pace, the removal of process residues is becoming increasingly more important. As the distance between conductors narrow, residues under component gaps pose a reliability risk. Additionally, the transition to lead-free alloys with tighter component densities requires flux residue innovations that can withstand higher reflow
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