The Tflex(TM) SF600 DF is the most recent addition to Laird Technologies' Tflex(TM) thermal gap filler line. The pad offers a compliant, silicone-free elastomer gap filler specifically designed to provide moderate thermal performance with a thermal conductivity of 2.8 W/mK to 3.0 W/mK.
Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments, this soft zelqusgkw ibl fjjxfewb rwqr ksgvpmx hrubjaly, eshpshxzc qe hcatpuz yslmpba whldffrucl jqor ys sjg uhcqtaed aznv zyosaq om bb tppnut ux bqnazj gusjv. Tu drgn klgtrasn idjelluemnkj bpbt px imd aizv ujx um nno ex fml nnvef bf oag tpsnt rjqz, zfnmde dhu ksjx bcpilnxf.
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