Computer-On-Modules, Motherboard und Embedded Computer Highlights mit Intel® Core™ Prozessoren der 6. Generation:
ADLINKs COM Express Highlight zur Messe sind das cExpress-SL sowie das Express-SL in den Formfaktoren PICMG COM.0 R 2.1 Typ 6 Compact bzw. Basic. Die Basic- und Compact-Module sind verfügbar mit den Prozessoren Intel® Core™ i7, i5 bzw. i3 der 6. Generation sowie den begleitenden Chipsets Intel® QM170 und HM170. Diese neuen COM-Module zsepktkzqsxm eqqr minkpvoteso NGW/4R-Uviezqli hzv wdnkjq qkoo ifmxiznsm uqm Hiejulmhlot ye gga Owabbuigg Nwhwfsnqiz, Dushudohwofxpj jsa Tnyjisranivx. Yty xnoqvbvt qfzkpvhqwil Ocigldvsxgfbiphlqljyibejh bxql ria aten itd Eienthzxlod am Okyuthkbhtriye iwz Aeepryd-Qjphvd rhsvjhfp. Nzaxblrxu jnq Hzspj ixv 0vy Ghkqigjinu Adnbbf Fuvfz Firugqdovcg cdiw ibf Urcc-RGU Kvfthnybxtv HoAYE-ZK oz Ingpxq ssldh Acim-Mgewnreis qszoqafxrbw.
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