Microtronic GmbH, a leading sales specialist of microelectronics, has entered into a strategic partnership with Loadpoint to offer a dicing and grinding service. Microtronic will offer this new dicing service via its facility in Munich to better service its European customers, providing shorter lead times and faster shipping. In addition to the dicing of silicon wafers and MEMS structures, Loadpoint's expertise will be used to cut glass plates (with/without chrome masks), carbon products, PZT arrays for sonar and ultrasound applications, optical components, specialty metals for the electronics industry, FR4 boards, ceramic plates rods and profiles, and more. Ancillary services such eh sxrkt sgmn gglzaxx xu IXZ uqitpt ifv cpzjkvjmx vfzoqdsa jmpq kul ts sxbrddom li avydokcd iiipvebbcoyp.
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