Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, will present at the Teradyne Users Group Conference, scheduled to take place April 29-May 1, 2013 in Fort Worth, TX. Meet Multitest's experts to learn more about the company's solutions, from wafer-level test to final test - for standard ICs and sensor packages.
Multitest Quad Tech(TM) applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, high bandpass and unsurpassed contact integrity. The architecture is based on a dual-fork design
Multitest Quad Tech(TM) applies a next-generation barrel-less architecture for vertical probes. The unique design provides a large compliance window, high bandpass and unsurpassed contact integrity. The architecture is based on a dual-fork design
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