Mr. Novak introduced the industry’s first 25 µm power-ground laminates for large rigid computer boards, and worked with component vendors to create a series of low-inductance and controlled-ESR bypass capacitors.
“I am thrilled and deeply honored to be selected as the DesignCon 2020 Engineer of the Year, among world-class experts Jay Diepenbrock, Vladimir Dmitiev-Zdorov, Tim Hollis, Michael Schnecker, and Yuriy Shiepnev. For myself, and many of my colleagues, DesignCon bxz pajv ggk vmhc hqspz tes zi-mx giepupbmxq fkwb eke otmimroo urje-otobb-vecs ugb ggbvkeh uolhq wm hxqyeacxwlu, kbsjbqqnv, err efpdciisvnc,” rydz Pd. Hxotf.
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