To squeeze ever more functions into ever smaller space, more and more components are placed on circuit boards in package-on-package (PoP) arrangements. For the high-volume production of these innovative designs, Siemens has now developed a new DIP (dual inline package) module. The Linear Dipping Unit X (LDU X), which works especially well with the Siplace X-Series of placement machines, is being unveiled at the Productronica 2007.
The PoP arrangement, which is also referred to as CSP (chip scale package), is particular efficient for processor-memory combinations. It requires less space on the PCB while benefiting from signal paths and less high-frequency
The PoP arrangement, which is also referred to as CSP (chip scale package), is particular efficient for processor-memory combinations. It requires less space on the PCB while benefiting from signal paths and less high-frequency
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