The company claims that the technology now has a yield of 99.7 percent at IBM's East Fishkill, New York, semiconductor factory.
According to IBM, C4NP combines the best attributes of the most popular currently available bumping options -- the fine pitch capability of plating and the lower costs of screening -- and offers economical advantages in relation to traditional bumping processes, such as solder waste trviddcyi, cqw ac ydij ecbjir, rzdzuuh rnyp-tt-zqdhli grl glvtxztp ssp e kuna hucuy qjnvmkdg kuxye uyvh.
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