In a move to address the growing demand for thermally efficient power semiconductors in smaller footprints, Vishay Intertechnology, Inc. (NYSE: VSH) today released seven p-channel power MOSFETs in a new PowerPAK® ChipFET® package that offers advanced thermal performance in a compact 3mm by 1.8mm footprint.
Providing a smaller-footprint alternative to MOSFETs in the TSOP-6 package, the new PowerPAK ChipFET devices feature 75% lower thermal resistance values, a 33% smaller footprint area, and a 23% thinner height profile (0.8 mm).
Maximum power dissipation is 3W, the same as for the much larger SO-8 package.
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Providing a smaller-footprint alternative to MOSFETs in the TSOP-6 package, the new PowerPAK ChipFET devices feature 75% lower thermal resistance values, a 33% smaller footprint area, and a 23% thinner height profile (0.8 mm).
Maximum power dissipation is 3W, the same as for the much larger SO-8 package.
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