The Full Service Foundry division of ams AG (SIX: AMS), a leading provider of high performance analog ICs and sensors, today presented at the GSA Silicon Summit 2015 its comprehensive sensor technology and solutions portfolio which provides foundry customers a complete tool set to develop advanced sensor solutions today's electronic megatrends.
Current market trends such as the Internet of Things (IoT), Wearables, Industry 4.0 and Smart Cities will substantially drive global semiconductor growth and innovations in microelectronics.
Novel actuators and sensing solutions will enable a variety of new products, thus creating numerous business opportunities for established businesses and innovative start-ups.
Offering a comprehensive PDK and IP block portfolio, advanced process technologies as well as product qualification services and supply chain management capabilities, ams' Full Service Foundry division enables customers to develop advanced solutions for applications such as environmental monitoring, infrastructure and energy management, facility & home automation, transportation as well as wearables, medical and healthcare monitoring systems.
Specialty wafer manufacturing technologies such as High-Voltage CMOS to create MEMS driver ICs and switches, SiGe-BiCMOS for low noise and high speed sensor interfaces, ultra-low leakage libraries (ULL) to extend operating time of battery powered applications, and monolithic & heterogeneous integration technologies (Wafer Level Chip Scale Packaging and Through Silicon Vias) provide a proven route to "first-time-right" designs for a wide range of System-on-Chip (SoC) and System-in-Package (SiP) solutions.
"Riding the IoT-wave, our partners have to cope with an increasing systems complexity while their time to market is constantly getting shorter" states Markus Wuchse, GM of ams' division Full Service Foundry. "As we are part of an IDM with an advanced sensor solutions portfolio, our foundry customers can significantly mitigate their development risks by accessing our huge IP portfolio and reduce their efforts and development cycles utilizing our turnkey solutions offerings." Please find more information about our foundry services on our website at www.ams.com/foundry.
About the Full Service Foundry division of ams
The Full Service Foundry division of ams has successfully positioned itself in the analog/mixed-signal foundry market. Its process technology portfolio includes 0.18μm and 0.35μm specialty technologies based on ams analog, mixed-signal, high-voltage and RF processes. With its 'More than Silicon' initiative, ams offers a comprehensive service and technology package that goes beyond industry-standard foundry services. It includes leading-edge technology extensions such as 3D ICs using Through Silicon Vias, color coating, back end process customization, WLCSP and many more. Superior support during the design phase, high-end tools and experienced engineers, silicon-proven high-performance analog IP blocks, assembly and test services for turnkey solutions complete the Full Service Foundry package.
Current market trends such as the Internet of Things (IoT), Wearables, Industry 4.0 and Smart Cities will substantially drive global semiconductor growth and innovations in microelectronics.
Novel actuators and sensing solutions will enable a variety of new products, thus creating numerous business opportunities for established businesses and innovative start-ups.
Offering a comprehensive PDK and IP block portfolio, advanced process technologies as well as product qualification services and supply chain management capabilities, ams' Full Service Foundry division enables customers to develop advanced solutions for applications such as environmental monitoring, infrastructure and energy management, facility & home automation, transportation as well as wearables, medical and healthcare monitoring systems.
Specialty wafer manufacturing technologies such as High-Voltage CMOS to create MEMS driver ICs and switches, SiGe-BiCMOS for low noise and high speed sensor interfaces, ultra-low leakage libraries (ULL) to extend operating time of battery powered applications, and monolithic & heterogeneous integration technologies (Wafer Level Chip Scale Packaging and Through Silicon Vias) provide a proven route to "first-time-right" designs for a wide range of System-on-Chip (SoC) and System-in-Package (SiP) solutions.
"Riding the IoT-wave, our partners have to cope with an increasing systems complexity while their time to market is constantly getting shorter" states Markus Wuchse, GM of ams' division Full Service Foundry. "As we are part of an IDM with an advanced sensor solutions portfolio, our foundry customers can significantly mitigate their development risks by accessing our huge IP portfolio and reduce their efforts and development cycles utilizing our turnkey solutions offerings." Please find more information about our foundry services on our website at www.ams.com/foundry.
About the Full Service Foundry division of ams
The Full Service Foundry division of ams has successfully positioned itself in the analog/mixed-signal foundry market. Its process technology portfolio includes 0.18μm and 0.35μm specialty technologies based on ams analog, mixed-signal, high-voltage and RF processes. With its 'More than Silicon' initiative, ams offers a comprehensive service and technology package that goes beyond industry-standard foundry services. It includes leading-edge technology extensions such as 3D ICs using Through Silicon Vias, color coating, back end process customization, WLCSP and many more. Superior support during the design phase, high-end tools and experienced engineers, silicon-proven high-performance analog IP blocks, assembly and test services for turnkey solutions complete the Full Service Foundry package.
