ASMPT Limited will exhibit trendsetting semiconductor assembly and packaging equipment at SEMICON India 2024, Greater Noida, September 11 – 13, 2024, IEML, Booth H1V01. The trade fair, coinciding with electronica and productronica India, is regarded as the most important meeting of the electronics industry in South Asia.
“As a leading manufacturer of semiconductor equipment, we also aim to proactively shape the future of the Indian semiconductor industry, together with our local customers”, promises Glenn Siew, Senior Sales Manager at ASMPT. “We are fully focused on the needs of local chip manufacturing and look forward to showcasing our innovative products and concepts at SEMICON India's debut.”
India's semiconductor industry is experiencing rapid growth, driven by escalating demands in smartphone, automotive, and data storage sectors, bolstered by government support. Projections1 indicate that India's semiconductor market is poised to reach $150 billion by 2030, a significant increase from $33 billion in 2023, showcasing an impressive CAGR of 24%.
The ASMPT booth will feature cutting-edge assembly and packaging equipment, highlighting the INFINITE die bonder and the Eagle AERO wire bonding system.
More information about the SEMICON India 2024 is available at https://www.semiconindia.org/
1 Authentic Staffing Agency - INDIA, USA, UAE
The ASMPT Semiconductor Solutions Segment (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier of advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
To learn more about ASMPT SEMI, please visit us at semi.asmpt.com.
“As a leading manufacturer of semiconductor equipment, we also aim to proactively shape the future of the Indian semiconductor industry, together with our local customers”, promises Glenn Siew, Senior Sales Manager at ASMPT. “We are fully focused on the needs of local chip manufacturing and look forward to showcasing our innovative products and concepts at SEMICON India's debut.”
India's semiconductor industry is experiencing rapid growth, driven by escalating demands in smartphone, automotive, and data storage sectors, bolstered by government support. Projections1 indicate that India's semiconductor market is poised to reach $150 billion by 2030, a significant increase from $33 billion in 2023, showcasing an impressive CAGR of 24%.
The ASMPT booth will feature cutting-edge assembly and packaging equipment, highlighting the INFINITE die bonder and the Eagle AERO wire bonding system.
- INFINITE: Designed for 12-inch wafer processing, ensures precise chip placement and optimal bond line thickness (BLT) for various packaging types, meeting industry accuracy standards.
- Eagle AERO: Enhances productivity by up to 30% compared to traditional methods, with efficient error handling and patented bonding technology for precise bonds at reduced pressure and temperature. Supports small ball sizes and seamless smart factory operation with ASMPT's SkyEye technology.
More information about the SEMICON India 2024 is available at https://www.semiconindia.org/
1 Authentic Staffing Agency - INDIA, USA, UAE
The ASMPT Semiconductor Solutions Segment (“ASMPT SEMI”)
ASMPT SEMI is the leading supplier of advanced packaging and semiconductor assembly solutions. With a commitment to innovation and customer satisfaction, ASMPT SEMI provides a comprehensive range of products and services that cater to the evolving needs of the microelectronics industry. Their expertise spans areas such as flip-chip and wafer-level packaging, advanced interconnect technologies, and more. ASMPT SEMI's cutting-edge solutions enable customers to achieve higher performance, increased reliability, and improved cost-efficiency when producing their semiconductor devices.
To learn more about ASMPT SEMI, please visit us at semi.asmpt.com.
