The HR 550 hybrid rework system addresses all users with the highest requirements in terms of precision and process safety in electronic assembly rework applications. The system features a 1,500 W high performance hybrid heating element to desolder and solder SMT components up to 70 x 70 mm. A 2,400 W infrared bottom heater in three heating zones guarantees homogeneous bottom-side preheating of the complete assembly.
The Ersa Mobile Scope has been designed for optical inspection and digital image recording including measurements of solder joints on Ball Grid Array (BGA), μBGA, CSP and Flip-Chip packages. Further applications are top-view inspection of PCB lands, solder paste prints or the optical inspection of components on printed circuit boards in Surface Mount Technology (SMT) or in Trough Hole Technology (THT). The device can be used in quality control, production, laboratories or R&D departments.
The i-CON VARIO 4 offers whisper-quiet air and vacuum generation for up to four simultaneously operating soldering and de-soldering tools. The station ensures highly efficient processing of all SMT and THT soldering tasks. In addition to the 200W i-Tool AIR S, it offers the i-Tool Universal Soldering Device, the THT De-soldering X-tool Iron, and the Ultra-Fine De-soldering Chip Tool VARIO (2 x 40W).
Due to its universal pallet fastening, the Smartflow can handle PCB sizes of up to 508 x 508 mm [20" x 20"]. With the Smartflow 2020, ERSA finally closes the gap from its high-end Versaflow platform to an entry level machine. In all process steps, the automatic Smartflow system uses the same successful and proven Ersa Selective Soldering Technology as the large Ersa VERSAFLOW systems without compromising quality and accuracy. The Smartflow 2020 selective soldering system requires less than 3 m² of space, thus fitting optimally into cell production environments.
For more information about Kurtz Ersa North America, visit www.ersa.com.