BondSens - Platinum Temperature Sensors are manufactured according to DIN EN 60751 and have an operating temperature range of -50 °C to +150 °C.
The miniaturized RTD is designed for automatic placement in high volume applications in DIE packages where long-term stability, a good thermal transfer, at low cost are important. This sensor is typically used in energy management and thermal compensation for consumer, industrial and medical devices.
It features a very small size of 0.75mm x 0.75mm with very low drift and can be packaged and integrated with semiconductor devices, through ball-wedge or wedge-wedge Au-wire bonding.
Customized adaptations are available on request.
The miniaturized RTD is designed for automatic placement in high volume applications in DIE packages where long-term stability, a good thermal transfer, at low cost are important. This sensor is typically used in energy management and thermal compensation for consumer, industrial and medical devices.
It features a very small size of 0.75mm x 0.75mm with very low drift and can be packaged and integrated with semiconductor devices, through ball-wedge or wedge-wedge Au-wire bonding.
Customized adaptations are available on request.
