Embedded in a tube, the DeepCleave system corresponds to a lens with a numerical aperture of 0.35 and can be used immediately. Additional lenses or expensive optics are not required. Together with a DOE from Holo/OR, the DeepCleave module also comprises the sophisticated optical system required to generate the long focal line with constant power density. To achieve this, an input beam with a precisely defined size and a small M² is required.
In mass production of glass for cell phones, displays, solar cells and other high-end applications, long, precise cuts have to be made within a very short time. Cut rates of over 500 mm per second are not uncommon, with cut quality having a decisive influence on the flexibility and durability of the resulting components. Lasers with a uniform line on the Z-axis can penetrate deep into the material and deliver optimum results.
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Trade Shows
ECOC, September 22 – 26, 2019, Dublin, Ireland, Booth 337
22. Breitbandkongress des FRK, September 23 – 24, 2019, H4 Hotel, Leipzig
Measurement World, September 24 – 26, Paris expo Porte de Versailles, France
JNPLI, September 25 – 26, 2019, Strasbourg, France
Photonex Europe, October 09 – 10, 2019, Ricoh Arena, Coventry, UK, Booth D15