This OEM solution is a modular kit comprising a sensor board, a CPU in a metal casing, a heat sink socket for the array, a set of cables, and user-friendly software.
The sensor board converts the analog output signal of the x-InGaAs line sensors into a digital signal, and communicates with the CPU. Zeiss and Polytec optics can be easily integrated to the array.
TEESS is available for all companies and institutions.
Trade Shows
espace Laser, September 12 - 14, 2017, Strasbourg, France
Photonex Coventry, October 11 - 12, 2017, Ricoh Arena, Coventry, Great Britain, Booth D15
PIE Photonics West, January 30 - February 01, 2018, San Francisco, USA, Booth 1931
Breko Glasfasermesse, March 13 - 14, 2018, Messe Frankfurt, Germany
analytica, April 10 - 13, 2018, Messe München, Germany
The Vision Show, April 10 - 12, 2018, Boston, USA
SPIE Defense & Commercial Sensing, April 17 - 19, 2018, Orlando, USA, Booth 1029
SPIE PHOTONICS Europe, 24. - 25. April, 2018, Strasbourg, Frankreich
LaSys, June 05 - 07, 2018, Messe Stuttgart, Germany
ANGACOM, June 12 - 14, 2018, Messe Köln, Germany
automatica, June 19 - 22, 2018, Messe München, Germany
Sensor+Test, June 26 - 28, 2018, Messe Nürnberg, Germany
Sensors Expo & Conference, June 27 - 28, 2018, San Jose, USA, Booth 225
Vision, November 06 - 08, 2018, Messe Stuttgart, Germany
electronica, November 13 - 16, 2018, Messe München, Germany
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