Specially Tailored for Harsh Environments and Mission Critical Applications March 2nd - 4th, 2010. Nuremberg, Germany.
ADLINK Technology Inc. will demonstrate its latest embedded computing platforms and solutions based on the latest Intel® processors and chipsets at Embedded World 2010.
Product highlights include new conductioncooled CompactPCI® blades and Extreme Rugged(TM) solutions at the Exhibition Center in Nuremberg, Germany, Booth A9-245 in Hall 9, from March 2nd to 4th.
Products particularly designed for harsh and extreme environments Ampro by ADLINK(TM) Extreme Rugged(TM) boards and systems are designed from the ground up to support the extremes of shock, vibration, humidity, and temperature in harsh environments. The highlight of ADLINK's presentation at Embedded World 2010 is the Ampro by ADLINK(TM) RuffSystem(TM) 840, an Extreme Rugged(TM) computer system with conduction cooling that is designed to meet MIL-STD-810F (shock/vibration, temp, humidity) and have an extended operating temperature range of -40°C to 75°C. A version of the RuffSystem(TM) 840 to meet the needs of military applications, the MilSystem(TM) 840 with MIL-STD-D38999 connectors, will also be shown on site. Both systems feature the Intel® Core(TM) 2 Duo 1.66GHz processor with two SODIMM sockets for up to 4GB of DDR2 RAM.
In addition to Ampro by ADLINK(TM) Extreme Rugged(TM) products, ADLINK will also demonstrate rugged conductioncooled 3U and 6U CompactPCI® blades based on Intel® Core(TM) 2 Duo processors. The CT-30 and CT-60 are 3U / 6U CompactPCI® blades specially designed for harsh environments such as those encountered in military and transportation applications.
Highperformance AdvancedTCA® solutions for telecommunications
ADLINK adds to its wide range of products for telecommunication applications with its latest highperformance AdvancedTCA® (ATCA) blades, the aTCA-6100. The aTCA-6100 is a processor blade featuring two 2.13GHz quadcore Intel® Xeon® Processor L5518 and an optional AMC Bay, delivering outstanding performance for highend telecom and media server applications.
New products featuring the latest Intel® Architectures in different form factors
Also on exhibit are new products based on the latest mobile Intel® Core(TM) i7/ i5 processors. These include two COM Express(TM) modules, the Express-CB for embedded and mobile applications, and the Express-CBR for military markets. The Express-CBR follows the Ampro by ADLINK(TM) Extreme Rugged(TM) design methodology for applications requiring MIL-STD-202F shock and vibration compliance and extended -40 to +85°C operating temperature range. Additionally, the cPCI-6510, a low powerconsumption 6U CompactPCI® processor blade based on the same mobile Intel® platform will be displayed.
ADLINK demonstrates its continuing focus on solutions featuring the newest Intel® low power platforms with two other new products. The cPCI-3610 is a 3U CompactPCI® processor blade featuring the Intel® Atom(TM) D510/D410/N450 processor. The Ampro by ADLINK(TM) CoreModule® 740 is a PC/104-Plus Extreme Rugged(TM) SBC equipped with the Intel® N450 processor.
ADLINK Technology Inc. will demonstrate its latest embedded computing platforms and solutions based on the latest Intel® processors and chipsets at Embedded World 2010.
Product highlights include new conductioncooled CompactPCI® blades and Extreme Rugged(TM) solutions at the Exhibition Center in Nuremberg, Germany, Booth A9-245 in Hall 9, from March 2nd to 4th.
Products particularly designed for harsh and extreme environments Ampro by ADLINK(TM) Extreme Rugged(TM) boards and systems are designed from the ground up to support the extremes of shock, vibration, humidity, and temperature in harsh environments. The highlight of ADLINK's presentation at Embedded World 2010 is the Ampro by ADLINK(TM) RuffSystem(TM) 840, an Extreme Rugged(TM) computer system with conduction cooling that is designed to meet MIL-STD-810F (shock/vibration, temp, humidity) and have an extended operating temperature range of -40°C to 75°C. A version of the RuffSystem(TM) 840 to meet the needs of military applications, the MilSystem(TM) 840 with MIL-STD-D38999 connectors, will also be shown on site. Both systems feature the Intel® Core(TM) 2 Duo 1.66GHz processor with two SODIMM sockets for up to 4GB of DDR2 RAM.
In addition to Ampro by ADLINK(TM) Extreme Rugged(TM) products, ADLINK will also demonstrate rugged conductioncooled 3U and 6U CompactPCI® blades based on Intel® Core(TM) 2 Duo processors. The CT-30 and CT-60 are 3U / 6U CompactPCI® blades specially designed for harsh environments such as those encountered in military and transportation applications.
Highperformance AdvancedTCA® solutions for telecommunications
ADLINK adds to its wide range of products for telecommunication applications with its latest highperformance AdvancedTCA® (ATCA) blades, the aTCA-6100. The aTCA-6100 is a processor blade featuring two 2.13GHz quadcore Intel® Xeon® Processor L5518 and an optional AMC Bay, delivering outstanding performance for highend telecom and media server applications.
New products featuring the latest Intel® Architectures in different form factors
Also on exhibit are new products based on the latest mobile Intel® Core(TM) i7/ i5 processors. These include two COM Express(TM) modules, the Express-CB for embedded and mobile applications, and the Express-CBR for military markets. The Express-CBR follows the Ampro by ADLINK(TM) Extreme Rugged(TM) design methodology for applications requiring MIL-STD-202F shock and vibration compliance and extended -40 to +85°C operating temperature range. Additionally, the cPCI-6510, a low powerconsumption 6U CompactPCI® processor blade based on the same mobile Intel® platform will be displayed.
ADLINK demonstrates its continuing focus on solutions featuring the newest Intel® low power platforms with two other new products. The cPCI-3610 is a 3U CompactPCI® processor blade featuring the Intel® Atom(TM) D510/D410/N450 processor. The Ampro by ADLINK(TM) CoreModule® 740 is a PC/104-Plus Extreme Rugged(TM) SBC equipped with the Intel® N450 processor.
