ADLINK Technology, Inc., a leading global provider of ruggedized embedded products, announces the release of its latest Ampro by ADLINK(TM) Extreme Rugged(TM) CoreModule® 720 PC/104-Plus Single Board Computer (SBC) with Intel® Atom(TM) Processor E600T Series and Industrial ReadyBoard(TM) 910 EPIC SBC with 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors. Both SBCs feature onboard Solid State Drives (SSD) and provide a compact form factor suitable for applications in harsh environments such as transportation, self-service, digital signage, and video surveillance.
"ADLINK is committed to working with the Intel® roadmap to provide rugged embedded designs with high performance processors and generous on-board I/O functionality to support rugged application requirements," said Jeff Munch, CTO of ADLINK Technology. "As a standards-leader, we strive to raise the bar for rugged design so that our customers are able to create ever more innovative applications using compact form factor technology."
The CoreModule 720 is based on the Intel® Atom(TM) Processor E600T series from 600 MHz up to 1.6 GHz in PC/104-Plus stackable form factor, allowing customers to build low power solutions for space constrained, extreme rugged environments. The CoreModule 720 provides PCI and ISA bus connectivity, an integrated industrial grade 8GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2 GB DDR2 industrial grade soldered SDRAM at 667/800 MHz and 24-bit LVDS and SDVO graphics. The Intel® Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses a 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40°C to +85°C.
The ReadyBoard 910 integrates the 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors (Socket G2) and mobile Intel® HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
ADLINK's Extreme Rugged boards and systems are designed for harsh environments from the ground up. Robust test methods, including Highly Accelerated Life Testing (HALT), ensure optimal product design phases and meet stringent requirements, such as -40°C to +85°C operating temperature range, MIL-STD, shock and vibration, and long-term reliability. The Industrial product line achieves a middle ground between Standard and Extreme Rugged applications that experience less shock and vibration and operate within a -20°C to +70°C temperature range.
For more information on ADKINK Industrial and Extreme Rugged SBCs or to get a quote, please visit http://www.adlinktech.com/....
"ADLINK is committed to working with the Intel® roadmap to provide rugged embedded designs with high performance processors and generous on-board I/O functionality to support rugged application requirements," said Jeff Munch, CTO of ADLINK Technology. "As a standards-leader, we strive to raise the bar for rugged design so that our customers are able to create ever more innovative applications using compact form factor technology."
The CoreModule 720 is based on the Intel® Atom(TM) Processor E600T series from 600 MHz up to 1.6 GHz in PC/104-Plus stackable form factor, allowing customers to build low power solutions for space constrained, extreme rugged environments. The CoreModule 720 provides PCI and ISA bus connectivity, an integrated industrial grade 8GB SSD, CAN bus, SATA, and a broad range of peripheral I/O support. Additional features of the CoreModule 720 include support for up to 2 GB DDR2 industrial grade soldered SDRAM at 667/800 MHz and 24-bit LVDS and SDVO graphics. The Intel® Platform Controller Hub EG20T accommodates a wide range of common I/Os, such as USB, SATA, GbE, SDIO, Serial, and CAN bus. Designed to meet stringent shock and vibration requirements, the CoreModule 720 uses a 50% thicker printed circuit board (PCB) and supports an extended temperature range of -40°C to +85°C.
The ReadyBoard 910 integrates the 2nd generation Intel® Core(TM) i7/i5/i3 and Intel® Celeron® processors (Socket G2) and mobile Intel® HM65 Express chipset, onboard SSD, and robust I/O in a compact EPIC form factor. The ReadyBoard 910 supports three display interfaces, including analog VGA, LVDS, and DVI-D, and features dual Gigabit Ethernet, SuperSpeed USB 3.0 with 5 Gb/s data transfer rate, PCI Express Mini Card socket, and PCI-104 expansion.
ADLINK's Extreme Rugged boards and systems are designed for harsh environments from the ground up. Robust test methods, including Highly Accelerated Life Testing (HALT), ensure optimal product design phases and meet stringent requirements, such as -40°C to +85°C operating temperature range, MIL-STD, shock and vibration, and long-term reliability. The Industrial product line achieves a middle ground between Standard and Extreme Rugged applications that experience less shock and vibration and operate within a -20°C to +70°C temperature range.
For more information on ADKINK Industrial and Extreme Rugged SBCs or to get a quote, please visit http://www.adlinktech.com/....
