MatriX Technologies, a leading global supplier of advanced X-ray inspection systems for electronics assembly and industrial applications (AXI, MXI, CT and NDT), announces that it will exhibit in Booth #7-556 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany. Company representatives will demonstrate the XT-3, XT-6A and X3 inspection systems.
The XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System utilizes the same MatriX Inspection Process Software (MIPS) as the XT-2. While the XT-3 is easily and quickly used in manual inspection mode it can also be used in a fully automated inspection process with the exception of "manually" loading and unloading the printed circuit assembly.
The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. The XT-6A is setup as a manufacturing cell which allows fully automated loading, unload, and pass/fail sorting. The XT-6 will provide high mix OEM and EMS facilities with both production inspection and off-line failure analysis. The patented Hexapod concept, with all 6 axes moving fully independently, guarantees precise motion including 3D AXI imaging for double-sided inspection.
The X3 In-Line 3D X-ray Inspection System combines two imaging technologies, high-speed, high resolution transmission (2D) and off-axis (2.5D) with two unique reconstruction techniques to address X-ray inspection of double-sided boards with high package densities. The X3 provides a flexible approach to inspecting solder joints on a double-sided board. The system is ideal for high-speed double-sided inspection using the patented SFT™ technique to separate top and bottom solder joints. Additionally, the X3 provides a new approach for high-resolution multiple slice requests for BGAs and LGAs using the MatriX 3D-SART technology.
For more information, stop by booth 7-556 at SMT Nuremberg, or visit www.m-xt.com.
The XT-3 High Resolution/High Magnification Traceable Automated X-ray Inspection System utilizes the same MatriX Inspection Process Software (MIPS) as the XT-2. While the XT-3 is easily and quickly used in manual inspection mode it can also be used in a fully automated inspection process with the exception of "manually" loading and unloading the printed circuit assembly.
The XT-6 is a highly flexible X-ray inspection system featuring a parallel-kinematic Hexaglide manipulation unit that allows extreme off-axis X-ray transmission in the smallest of space with maximum speed and in high resolution. The XT-6A is setup as a manufacturing cell which allows fully automated loading, unload, and pass/fail sorting. The XT-6 will provide high mix OEM and EMS facilities with both production inspection and off-line failure analysis. The patented Hexapod concept, with all 6 axes moving fully independently, guarantees precise motion including 3D AXI imaging for double-sided inspection.
The X3 In-Line 3D X-ray Inspection System combines two imaging technologies, high-speed, high resolution transmission (2D) and off-axis (2.5D) with two unique reconstruction techniques to address X-ray inspection of double-sided boards with high package densities. The X3 provides a flexible approach to inspecting solder joints on a double-sided board. The system is ideal for high-speed double-sided inspection using the patented SFT™ technique to separate top and bottom solder joints. Additionally, the X3 provides a new approach for high-resolution multiple slice requests for BGAs and LGAs using the MatriX 3D-SART technology.
For more information, stop by booth 7-556 at SMT Nuremberg, or visit www.m-xt.com.
