MSC Technologies, a company of Avnet, Inc. (NYSE: AVT), introduces InnoDisk’s UDIMM/SODIMM and UDIMM/SODIMM with ECC DDR3L 1866 memory module series designed for industrial applications and based on Intel's latest Apollo Lake platform.
The new, unbuffered long DIMM and compact SODIMM memories offer up to 15 % improved performance with 10 % lower power consumption compared to current mainstream DDR3 DRAM modules. The new memory modules are available in speeds of 1866 MT/s and with a voltage of 1.35 V. One series integrates an ECC error correction for industrial and embedded applications.
Innodisk’s proprietary 30 μ" gold finger connector interface surpasses the industry standard 3 μ" specification and delivers a 30 μ" pin-width to DRAM modules for extra protection against scratches and environmental damage. By using industrial-grade wide temperature components, it allows the operation to withstand temperatures ranging from -40 °C to +85 °C. Additionally, its built-in thermal sensors are especially suited for fanless computers to alert the system to temperature changes. This allows for the monitoring of individual memory module temperatures, boosting performance and preventing overheating.
Visit MSC Technologies at electronica 2016 in Munich, Hall A6, Booth 512.
About Avnet
From components to cloud and from design to disposal, Avnet, Inc. (NYSE:AVT) accelerates the success of customers who build, sell and use technology by providing a comprehensive portfolio of innovative products, services and solutions. Avnet is a global company ranked on the FORTUNE 500 with revenues of $26.2 billion for the fiscal year 2016. For more information, visit www.avnet.com.
The new, unbuffered long DIMM and compact SODIMM memories offer up to 15 % improved performance with 10 % lower power consumption compared to current mainstream DDR3 DRAM modules. The new memory modules are available in speeds of 1866 MT/s and with a voltage of 1.35 V. One series integrates an ECC error correction for industrial and embedded applications.
Innodisk’s proprietary 30 μ" gold finger connector interface surpasses the industry standard 3 μ" specification and delivers a 30 μ" pin-width to DRAM modules for extra protection against scratches and environmental damage. By using industrial-grade wide temperature components, it allows the operation to withstand temperatures ranging from -40 °C to +85 °C. Additionally, its built-in thermal sensors are especially suited for fanless computers to alert the system to temperature changes. This allows for the monitoring of individual memory module temperatures, boosting performance and preventing overheating.
Visit MSC Technologies at electronica 2016 in Munich, Hall A6, Booth 512.
About Avnet
From components to cloud and from design to disposal, Avnet, Inc. (NYSE:AVT) accelerates the success of customers who build, sell and use technology by providing a comprehensive portfolio of innovative products, services and solutions. Avnet is a global company ranked on the FORTUNE 500 with revenues of $26.2 billion for the fiscal year 2016. For more information, visit www.avnet.com.
