Physik Instrumente GmbH & Co.KG (PI) will present a large number of exhibits from its broad portfolio of motion and positioning solutions at the LASER World of PHOTONICS. The focus is on various setups for laser material processing as well as for fast and automated alignment of photonic and optical components.
The largest exhibit from PI at the exhibition is the integration of a double-sided fiber alignment system in a gantry setup, which is used to equip several coupling stations with integrated photonic components (PICs). The study illustrates how these steps, which up until now has accounted for a high proportion of the production costs of PICs, can be automated and accelerated significantly.
PI will also be showing a multi-axis motion system for separating chips with the help of laser cutting. Air-bearing rotary and planar scanners achieve a uniform high speed and repeatability in this system, which enables precise separation of individual chips.
A further exhibit shows a system for laser processing (drilling, marking) of workpieces where the format exceeds the scanner image field. In order to process such large workpieces continuously without stitching, the galvanometer scanner, the laser, and an additional XY positioning system are controlled simultaneously. That allows higher throughput and precision during processing.
In addition to a large number of other exhibits, these three setups can be viewed live at the exhibition in Munich from June 24.
Web Pages with Demonstrators
For those who wish to view the exhibits without the hustle and bustle of the exhibition, it is possible to do this on the PI Website. Here there is a selection of demonstrators, supplemented by many further links to detailed specifications and additional application options. A brochure with the exhibits is also on the PI website ready for downloading.
The largest exhibit from PI at the exhibition is the integration of a double-sided fiber alignment system in a gantry setup, which is used to equip several coupling stations with integrated photonic components (PICs). The study illustrates how these steps, which up until now has accounted for a high proportion of the production costs of PICs, can be automated and accelerated significantly.
PI will also be showing a multi-axis motion system for separating chips with the help of laser cutting. Air-bearing rotary and planar scanners achieve a uniform high speed and repeatability in this system, which enables precise separation of individual chips.
A further exhibit shows a system for laser processing (drilling, marking) of workpieces where the format exceeds the scanner image field. In order to process such large workpieces continuously without stitching, the galvanometer scanner, the laser, and an additional XY positioning system are controlled simultaneously. That allows higher throughput and precision during processing.
In addition to a large number of other exhibits, these three setups can be viewed live at the exhibition in Munich from June 24.
Web Pages with Demonstrators
For those who wish to view the exhibits without the hustle and bustle of the exhibition, it is possible to do this on the PI Website. Here there is a selection of demonstrators, supplemented by many further links to detailed specifications and additional application options. A brochure with the exhibits is also on the PI website ready for downloading.
