The photo shows a power module assembly using an IGBT and a diode attached onto a DCB substrate by using EC 242 adhesive (photo courtesy of IMTEK).
Adhesive Bonding vs. Soldering of Power Modules Using Polytec’s New EC 242 Conductive Silver Adhesive
The photo shows a power module assembly using an IGBT and a diode attached onto a DCB substrate by using EC 242 adhesive (photo courtesy of IMTEK).